We established 6 inch WLP process in addition to conventional WLP process of small diameter resin substrate (1 inch).
PMT Package Foundry has started cooperation with Kyushu Works of Maxall, Ltd (Tagawa-gun, Fukuoka, Japan) to expand business since April 2022 and we have done 6 inch tryal production line establishment while using Maxells' fab.
What will be changed by establishment 6 inch WLP process
This establishment will change following;
- Available package size will be expanded to Max. 20mm x 20mm!
Though up to 14.1mm × 14.1mm package can be available in 1 inch process, from 0.7mm x 0.7mm to 20mm x 20mm package became available in 6 inch process.
(* More than 20mm packages is subject to negotiation) - Contructed production of 8 inch RDL pattern will be available!
Using production line for both 6 and 8 inch in Cu plating and photolithography process allows 8 inch RDL pattern process. - Scale of trial production will be expanded!
Expandentation of capacity allows trial production of several hundreds of Fan-Out package.
Package Foundry
PMT Package Foundry is a foundry service specializing in small volume manufacturing of FOWLP (Fan-Out Wafer Level Package) and WLCSP (Wafer Level Chip Size Package).
We fabricate Cu rewiring packages utilizing semiconductor front-end process and plating technology.
We support customers' PoC (Proof of Concept) for chip development and product development.
Details of PMT Package Foundry can be shown from following link>> Package Foundry
