Package Foundry
We carry out contracted production of semiconductor package such as FOWLP or SiP.
Transmission rate and heat dissipation are expected to be improved because of small size and low profile by utilizing rewiring technology.
We will exhibit at NEPCON JAPAN 2024!
2024年1月10日
Winter recess
2023年12月4日
We will exhibit at SEMICON JAPAN 2023!
2023年11月30日