Prototype of Semiconductor Package of 6 inch Wafer/ PMT CORPORATION
Prototype of Semiconductor Package of 6 inch Wafer

We established 6 inch WLP process in addition to conventional WLP process of small diameter resin substrate (1 inch).

PMT Package Foundry has started cooperation with Kyushu Works of Maxall, Ltd (Tagawa-gun, Fukuoka, Japan) to expand business since April 2022 and we have done 6 inch tryal production line establishment while using Maxells' fab.

What will be changed by establishment 6 inch WLP process

This establishment will change following;

  • Available package size will be expanded to Max. 20mm x 20mm!
    Though up to 14.1mm × 14.1mm package can be available in 1 inch process, from 0.7mm x 0.7mm to 20mm x 20mm package became available in 6 inch process.
    (* More than 20mm packages is subject to negotiation)
  • Contructed production of 8 inch RDL pattern will be available!
    Using production line for both 6 and 8 inch in Cu plating and photolithography process allows 8 inch RDL pattern process.
  • Scale of trial production will be expanded!
    Expandentation of capacity allows trial production of several hundreds of Fan-Out package.

Package Foundry

Integration of front-end (wafer processing) and packaging process / PMT CORPORATION
Schematic diagram of FOWLP (Fan-Out Wafer Level Package) / PMT CORPORATION

PMT Package Foundry is a foundry service specializing in small volume manufacturing of FOWLP (Fan-Out Wafer Level Package) and WLCSP (Wafer Level Chip Size Package).

We fabricate Cu rewiring packages utilizing semiconductor front-end process and plating technology.

We support customers' PoC (Proof of Concept) for chip development and product development.

Details of PMT Package Foundry can be shown from following link>> Package Foundry