Machining Metals

メタル加工│株式会社ピーエムティー

Machining hard-to-process material or low-expansion materials such as 42 alloy and Invar is available in addition to Aluminum, Stainless, Cemented Carbide, Tool Steel.

Furthermore, brittle materials of Silicon or Glass (SiC) can be processed also.
Please feel free to contact us.

Correspondence Table of Metal Machining

We propose the optimal processing method depending on customers' request such as physical properties of material and accuracy requirement.
Major materials that we've often machined are shown in following table, but please feel free to ask us regarding of another materials or methods.

MachiningGrindindWEDMWire-saw Cutting
Stainless
Aluminum
Nickel Alloy
Silicon
Glass
Cemented Carbide

★ - Specialty ○ - Possible No Mark - Impossible

Example of Metal Machining

メタル加工―難削材(42アロイ)切削加工│株式会社ピーエムティー

Geometrical Hard-to-process Material

High machining technology enables to process even 42 alloy of hard-to-process material in fine form.

Guaranteed accuracy is each +/- 1um for parallelism, flatness, and squareness.
We propose optimal processing method according to customers' requirement or budget.

Inquiry

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Application Examples

Precision Die and its Parts

Designing and manufacturing ultra precision die and its parts that submicron accuracy is required by making advantage of both high machining technology and designing know-how cultivated in machinery business for semiconductor and electric component industry.

In addition to producing from drawing, we've also done reproducing worn or damaged parts, proposing life improvement by modifying shape or physical property, and integration of production line.

Outerリンク
メタル加工―半導体IC用T/F金型(複数ステージ)│株式会社ピーエムティー
Trimming & Forming Die for Semiconductor IC
(Multiple Stage)
メタル加工―半導体IC用T/F金型(単数ステージ)│株式会社ピーエムティー
Trimming & Forming Die for Semiconductor IC
(Single Stage)
メタル加工―プレス金型部品│株式会社ピーエムティー
Parts of Press Die
メタル加工―半導体IC金型部品│株式会社ピーエムティー
Parts of Die for Semiconductor IC